Korean cooling firm signs AIDC supply MOU with AI systems integrator
The two companies will coordinate equipment volumes, production and maintenance for AI data center cooling under a deal signed at HARFKO 2026 in Goyang.
오텍캐리어 signed a memorandum of understanding with 비이랩 on October 23, 2026, to cooperate on supplying cooling solutions for AI data centers (AIDC), according to datanet.co.kr. The agreement was concluded at HARFKO 2026, the heating, air-conditioning and refrigeration trade show held at KINTEX.
The cooperation covers chillers, air handling units and cooling distribution units (CDUs) that 오텍캐리어 manufactures or holds the sales rights for in Korea. It also includes technical support for installation, commissioning and maintenance.
Under the arrangement, 비이랩 will define the required cooling equipment volumes, specifications and installation schedules for its AIDC projects, while 오텍캐리어 will coordinate production and delivery.
The deal follows earlier work by 오텍캐리어 in the data center sector. In August 2026, the company won a contract to supply cooling solutions, including oil-free inverter turbo chillers and maintenance, for a 48MW hyperscale data center under construction in the Seoul metropolitan area by an Asia-Pacific data center developer and operator.
오텍캐리어 was also recently selected as preferred bidder for cooling equipment at the 200MW IT-capacity Gumi AI cluster data center project, where it proposed 160 AquaForce 30XFZ inverter screw chillers. That project addresses computing demand based on Nvidia's next-generation Rubin platform, and the order would be the company's largest single-project chiller supply if finalised. The Carrier CDU model 65LL, rated up to 1.3MW, has meanwhile completed Nvidia quality certification, with a 2.6MW model under testing and certification targeted for the end of 2026.
Quick answers
What does the 오텍캐리어 and 비이랩 agreement cover?
Chillers, air handling units and CDUs that 오텍캐리어 manufactures or holds Korean sales rights for, plus installation, commissioning and maintenance support.
Where was the MOU signed?
At HARFKO 2026, held at KINTEX, on October 23, 2026.
Who decides the equipment specifications?
비이랩 sets the cooling equipment volumes, specifications and installation schedules for its AIDC projects, and 오텍캐리어 coordinates production and delivery.