SEDEX 2026 Opens at COEX With Record 300 Companies
The 28th Semiconductor Exhibition runs October 14-16 in Seoul under the theme "The Era of Silicon Intelligence," with 888 booths, the largest edition to date.
The 28th Semiconductor Exhibition, SEDEX 2026, opened on October 14 at COEX in Seoul and runs through October 16, hosted by the Korea Semiconductor Industry Association, according to etnews.com. This year's edition is the largest to date, with 300 companies occupying 888 booths, about 70 more participating companies than the previous year.
The event is held under the theme "The Era of Silicon Intelligence." Samsung Electronics is presenting high bandwidth memory (HBM), mobile image sensors and processors, automotive high-reliability semiconductors, foundry solutions and next-generation 3D memory architecture.
SK hynix is presenting next-generation HBM4E and high bandwidth flash (HBF) technology under the theme "RUN."
Keynotes and specialized sessions
Keynote speeches on opening day cover AI semiconductors in the physical AI era, challenges and opportunities in future computing, and memory innovation direction in the AI era.
Specialized sessions include the Semiconductor Advanced Packaging R&D International Conference, the JEDEC Global Standard Forum, and a semiconductor market outlook seminar. A semiconductor talent recruitment fair is also being held with 18 semiconductor companies and 433 job seekers.
Quick answers
When and where is SEDEX 2026 held?
SEDEX 2026 runs from October 14 to October 16 at COEX in Seoul, hosted by the Korea Semiconductor Industry Association.
How many companies and booths are at SEDEX 2026?
300 companies are participating across 888 booths, the largest edition to date, with about 70 more companies than the previous year.
What are Samsung Electronics and SK hynix presenting at SEDEX 2026?
Samsung Electronics is presenting HBM, mobile image sensors and processors, automotive high-reliability semiconductors, foundry solutions and next-generation 3D memory architecture; SK hynix is presenting HBM4E and high bandwidth flash (HBF) technology under the theme "RUN."