Solidigm picks Goldman Sachs, Morgan Stanley to lead US IPO
The NAND maker also added JPMorgan Chase, Citigroup and UBS to the underwriting syndicate, Bloomberg reports.
Solidigm has selected Goldman Sachs and Morgan Stanley as lead underwriters for a planned listing on the U.S. stock market, according to Bloomberg. JPMorgan Chase, Citigroup and UBS have also joined the underwriting syndicate.
The company is working to complete a pre-IPO investment round, and could raise about $10 billion through the offering.
SK hynix said nothing specific has been confirmed regarding Solidigm's plans.
Background
SK hynix launched Solidigm in 2021 after acquiring Intel's NAND flash business for about $9 billion. Solidigm has been seen as possibly listing in the U.S. as early as 2027 with a valuation of up to $100 billion.
Quick answers
Who are the lead underwriters for Solidigm's US IPO?
Goldman Sachs and Morgan Stanley, according to Bloomberg. JPMorgan Chase, Citigroup and UBS have also joined the syndicate.
How much could Solidigm raise in the IPO?
About $10 billion.
What did SK hynix say about the listing plans?
SK hynix said nothing specific has been confirmed regarding Solidigm's plans.