Apple Engineers Detail iPhone Duo Heat Management in PCMag Interview
Apple VP of silicon engineering Dan Murray and thermal product design senior manager Banafsheh Barabadi discussed how the iPhone Duo handles heat.
Apple engineers discussed how heat issues were addressed in the iPhone Duo, the company's thin-design smartphone, in an interview with PCMag. Dan Murray, Apple's VP of silicon engineering, and Banafsheh Barabadi, senior manager of thermal product design, spoke about the device's thermal management.
The interview focused on how the iPhone Duo manages heat despite its thin design, which can constrain the space available for cooling components. Murray and Barabadi outlined the engineering work behind the phone's heat dissipation.
Apple has not disclosed further technical specifications or performance figures from the discussion. The full interview is available at PCMag.