GlobalFoundries to Make TSMC CoWoS Interposers in $2 Billion Deal
GlobalFoundries will produce silicon interposers for TSMC's CoWoS advanced packaging at its Malta, New York fab, with volume production set for the first half of 2028.
GlobalFoundries and TSMC have signed a five-year manufacturing agreement valued at $2 billion under which GlobalFoundries will produce silicon interposers for TSMC's CoWoS advanced packaging technology. The deal, reported by tomshardware.com, establishes a U.S.-based manufacturing source for the components.
GlobalFoundries will expand manufacturing capacity at its fabrication facility in Malta, New York, to build the interposers. Volume production is scheduled to ramp up in the first half of 2028.
Silicon interposers are a key element of CoWoS packaging, the technology used to assemble high-bandwidth memory and logic dies into AI and HPC accelerators. TSMC has relied on CoWoS for advanced packaging of such chips.
The agreement gives TSMC an additional, U.S.-located source for interposers at a time when advanced packaging capacity has been a constraint on accelerator supply.
Background
GlobalFoundries exited development of leading-edge process technologies in 2018 and was consequently unable to produce leading-edge AI and HPC accelerators.
Quick answers
What will GlobalFoundries make for TSMC?
GlobalFoundries will produce silicon interposers for TSMC's CoWoS advanced packaging technology.
When does production start?
Volume production is scheduled to ramp up in the first half of 2028.
Where will the interposers be made?
At GlobalFoundries' fabrication facility in Malta, New York, giving the arrangement a U.S.-based manufacturing source.