Samsung's Lee Jae-yong visits Yokohama packaging lab
The chairman reviewed advanced packaging research at the Advanced Package Lab and discussed cooperation with Japanese materials and equipment suppliers.
Samsung Electronics Chairman Lee Jae-yong visited the Advanced Package Lab (APL), the company's semiconductor packaging research base in Yokohama, Japan, on November 1, according to inews24.com.
The visit was the first on-site inspection of the lab since it officially opened on September 8, 2025. Lee reviewed the status of advanced packaging material and process element technology development with APL researchers.
He also discussed ways to cooperate with Japanese materials, components and equipment companies, the report said.
Samsung established APL in Yokohama in 2023 and plans to invest 40 billion yen (about 350 billion won) over five years from 2024 to build the research base.
The lab will expand its research scope to wafer bonding, glass substrates and new packaging structures for low-power, high-performance semiconductors.
Quick answers
When did Lee Jae-yong visit Samsung's Advanced Package Lab?
He visited the Yokohama research base on November 1, the first on-site inspection since APL officially opened on September 8, 2025.
How much is Samsung investing in the Yokohama research base?
Samsung plans to invest 40 billion yen, about 350 billion won, over five years from 2024.
What will APL research going forward?
The lab will expand into wafer bonding, glass substrates and new packaging structures for low-power, high-performance semiconductors.