GlobalFoundries Unveils FDX Fusion 7nm FD-SOI Process for 2028 Production
GlobalFoundries announced FDX Fusion, claiming more than double the transistor density of its 22FDX process, with initial demo silicon due in early 2027.
GlobalFoundries announced FDX Fusion, a 7nm-class FD-SOI fabrication process, on Tuesday. According to tomshardware.com, the company plans to start production of chips based on the process at its Dresden, Germany facility in 2028.
GlobalFoundries said FDX Fusion promises more than twice the transistor density of its 22FDX process. The first process design kit is planned for mid-2027, with initial demo silicon for customer evaluation expected in early 2027.
The process will support RF transistors with fT/fmax of up to 0.5 THz, analog and mixed-signal circuitry, embedded nonvolatile memory, and in-memory computing. GlobalFoundries also intends to provide processor IP based on MIPS, ARC, and RISC-V architectures.
The company said BMW, Bosch, Infineon, NXP, Siemens, and Tesla have expressed interest in FDX Fusion. Infineon confirmed it is collaborating on future 7nm-class technologies for radar and wireless communications.
Background
In 2018, GlobalFoundries abandoned development of leading-edge nodes and canceled its 7nm-class FinFET fabrication technology co-developed with IBM. The company later focused on enhancements to 22FDX and introduced 22FDX+.
Quick answers
When will GlobalFoundries start production of FDX Fusion?
Production is planned for 2028 at the company's Dresden, Germany facility.
What is the transistor density of FDX Fusion?
GlobalFoundries says it promises more than twice the transistor density of its 22FDX process.
When will demo silicon be available for FDX Fusion?
Initial demo silicon for customer evaluation is expected in early 2027.