High-NA EUV output schedules take shape from 2028
Industry sources say DRAM makers including Samsung Electronics will begin High-NA EUV ramp-up from 2028, pushing certification work onto Korean mask and pellicle suppliers.
High-NA EUV mass-production adoption schedules are being set from 2028 onward, industry sources said on October 26, according to digitaltoday.co.kr, with preparation work shifting toward the mask industry.
Bits&Chips reported that DRAM makers including Samsung Electronics will begin High-NA EUV ramp-up in earnest from 2028. Intel plans to start High-NA EUV mass production two years earlier than TSMC, accepting the cost and risk of early adoption, while TSMC has decided to begin in 2030. Samsung's foundry division has set a schedule similar to TSMC's.
Korean suppliers prepare certification
According to SK Securities, FST is expected to receive ASML certification for its CNT-based EUV pellicle within this year and enter the market next year. FST's EUV-related infrastructure equipment is scheduled to be installed at a major customer's most advanced foundry line in the first quarter of next year.
S&S Tech completed its dedicated EUV center in Yongin in October 2025 and aims to finish customer qualification testing of EUV blank masks in early next year. The company began customer quality testing of its EUV pellicle in September.
EUV masks' share of photomask volume rose from about 1% in 2020 to about 7% in 2025, according to SEMI. Three Japanese companies — Shin-Etsu MicroSi, Hoya and AGC — held about 86% of the blank mask market by 2025 revenue, according to QY Research.
Quick answers
When will High-NA EUV mass production begin?
Schedules are being set from 2028 onward. Intel plans to start two years earlier than TSMC, which has decided on 2030.
Which Korean companies are preparing EUV mask and pellicle products?
FST, which is expected to receive ASML certification for its CNT-based EUV pellicle, and S&S Tech, which is testing EUV blank masks and pellicles.