ASICLAND to Showcase AxHub AI Chip Platform at SEDEX 2026
ASICLAND will present its AxHub design and verification platform, ASIC turnkey service, and TSMC N2 and 3DFabric technology at SEDEX 2026.
ASICLAND announced it will participate in SEDEX 2026 and present customer-tailored semiconductor development and productization plans at the exhibition, according to datanet.co.kr.
The company will present AxHub, its self-developed AI semiconductor design and verification integrated platform, and showcase its ASIC design and mass-production turnkey service. It will also unveil real chips and wafers developed together with major customers in the AI and memory fields.
At the event, ASICLAND will introduce TSMC's 2nm process N2, which uses a nanosheet transistor structure, along with TSMC's advanced packaging platform 3DFabric, covering 2.5D and 3D semiconductor integration technology.
Customer ideas and mass production
CEO Lee Jong-min stated that implementing customers' semiconductor development ideas as actual products requires an approach considering process, packaging and mass production as well as design.
ASICLAND is a TSMC VCA (Value Chain Alliance) partner and has strengthened advanced-node design and advanced-packaging capabilities based on its Korea headquarters and Taiwan R&D center. It signed an eSSD controller solution development contract with Fadu, and secured a contract with SK hynix for next-generation eSSD controller design and tape-out support.
Quick answers
What will ASICLAND present at SEDEX 2026?
ASICLAND will present its AxHub AI semiconductor design and verification integrated platform, its ASIC design and mass-production turnkey service, TSMC advanced-node and advanced-packaging technology, and real chips and wafers developed with major customers in the AI and memory fields.
Which TSMC technologies will ASICLAND introduce at SEDEX 2026?
ASICLAND will introduce TSMC's 2nm process N2, which uses a nanosheet transistor structure, and TSMC's advanced packaging platform 3DFabric, covering 2.5D and 3D semiconductor integration technology.