CIT Unveils ASEDep Semiconductor Packaging Substrate Solution
ASEDep uses CIT's proprietary ASE technology and is claimed to raise data transmission speed by up to 30% while cutting heat and signal loss.
CIT (Copper Innovation Technologies) has unveiled ASEDep, a semiconductor packaging substrate manufacturing solution built on its proprietary ASE (Atomic Sputtering Epitaxy) technology, according to it.donga.com.
The company claims ASEDep can increase data transmission speed by up to 30% while reducing heat and signal loss. CIT also says the solution can be applied to existing production lines with less than 2% additional equipment investment.
CIT has secured 11.7 billion KRW in a Series A funding round, with participation from six institutions including Hana Ventures and BA Partners.
In October, CIT won the grand prize at the Global Scale-up Champions Awards of FLY ASIA 2026, held at BEXCO in Busan from October 7 to 8. The company was also selected for the TechCrunch Startup Battlefield 200 and is challenging for a CES 2027 Innovation Award.
Quick answers
What is ASEDep?
ASEDep is a semiconductor packaging substrate manufacturing solution unveiled by CIT, based on the company's proprietary ASE (Atomic Sputtering Epitaxy) technology.
What performance improvements does ASEDep claim?
CIT claims ASEDep can increase data transmission speed by up to 30% while reducing heat and signal loss, and can be applied to existing production lines with less than 2% additional equipment investment.
How much funding has CIT raised?
CIT secured 11.7 billion KRW in a Series A funding round with participation from six institutions including Hana Ventures and BA Partners.