TSMC drafts 3D DRAM production plans at Nvidia's request
The report says no investment size or mass-production timeline has been set, and TSMC says it does not comment on market rumors.
TSMC has begun drawing up plans to produce 3D DRAM, according to The Information, which cited two people familiar with the matter. The effort follows a direct request from Nvidia for the foundry to make memory for it.
According to the report, TSMC is weighing whether to build new fabs or acquire existing semiconductor plants that could be converted into memory production facilities. No investment size and no mass-production timeline have been decided.
The work is reportedly being led by TSMC's senior vice president of advanced packaging, who previously headed Micron's Taiwan business.
TSMC said it does not comment on market rumors or speculation and will keep focusing on its core foundry business. Nvidia declined to comment.
Pressure on memory supply
Rising DRAM prices amid surging AI chip demand have led chip designers such as Nvidia and Apple to look for new supply sources. In 2024, SK hynix and TSMC signed an agreement to cooperate on developing next-generation HBM4 and advanced packaging technology.
Nvidia has also reportedly asked Samsung Electronics, SK hynix and Micron to produce the base die for its next-generation custom HBM, known as NVHBM, using TSMC's 3-nanometer process.
Quick answers
Has TSMC confirmed it will make 3D DRAM for Nvidia?
No. TSMC said it does not comment on market rumors or speculation. The plan was reported by The Information, citing two people familiar with the matter.
When will TSMC start mass production of 3D DRAM?
No mass-production timeline has been decided, and no investment size has been set, according to the report.
Who is leading the 3D DRAM effort at TSMC?
TSMC's senior vice president of advanced packaging, who previously headed Micron's Taiwan business, is reportedly leading the effort.